缺陷增强铜/金刚石界面热导的分子动力学研究

English

杨碧环, 李东皓, 祝捷, 亓鹏飞, 唐大伟

Molecular Dynamics Study on Thermal Conductance of Copper/Diamond Interface Enhanced by Defects

YANG Bihuan, LI Donghao, ZHU Jie, QI Pengfei, TANG Dawei

工程热物理学报 . 2023, (3): 781 -786 .