On the Modelling of Thermal Boundary Resistance in Semiconductor Heterostructures

On the Modelling of Thermal Boundary Resistance in Semiconductor Heterostructures

YANG Guang, CAO Bingyang

Journal of Engineering Thermophysics ›› 2024, Vol. 45 ›› Issue (4) : 1132-1138.

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工程热物理学报

Journal of Engineering Thermophysics

PDF(12956 KB)

Journal of Engineering Thermophysics ›› 2024, Vol. 45 ›› Issue (4) : 1132-1138.

On the Modelling of Thermal Boundary Resistance in Semiconductor Heterostructures

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 45(4): 1132-1138

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