Study on Thermal Conductance in Bimodal-Pore Structure of Mesoporous Silica
WEI Gaosheng, HUANG Chao, CUI Liu, DU Xiaoze
Journal of Engineering Thermophysics ›› 2023, Vol. 44 ›› Issue (2) : 517-524.
Study on Thermal Conductance in Bimodal-Pore Structure of Mesoporous Silica
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