Molecular Dynamics Study on Thermal Conductance of Copper/Diamond Interface Enhanced by Defects

Molecular Dynamics Study on Thermal Conductance of Copper/Diamond Interface Enhanced by Defects

YANG Bihuan, LI Donghao, ZHU Jie, QI Pengfei, TANG Dawei

Journal of Engineering Thermophysics ›› 2023, Vol. 44 ›› Issue (3) : 781-786.

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工程热物理学报

Journal of Engineering Thermophysics

PDF(5322 KB)

Journal of Engineering Thermophysics ›› 2023, Vol. 44 ›› Issue (3) : 781-786.

Molecular Dynamics Study on Thermal Conductance of Copper/Diamond Interface Enhanced by Defects

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 44(3): 781-786

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