Thermal Expansion Coefficient of Cu/Graphene Nanocomposite by Molecular Dynamic Simulation

Thermal Expansion Coefficient of Cu/Graphene Nanocomposite by Molecular Dynamic Simulation

ZHANG Tianyu, LI Chenguang, LIU Wenkai, JU Shenghong, ZHAO Changying

Journal of Engineering Thermophysics ›› 2024, Vol. 45 ›› Issue (10) : 3137-3142.

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工程热物理学报

Journal of Engineering Thermophysics

PDF(12952 KB)

Journal of Engineering Thermophysics ›› 2024, Vol. 45 ›› Issue (10) : 3137-3142.

Thermal Expansion Coefficient of Cu/Graphene Nanocomposite by Molecular Dynamic Simulation

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2024, 45(10): 3137-3142

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