Electrical-thermal-structural Coupling Analysis of Through Silicon Vias in 3D Packaging

Electrical-thermal-structural Coupling Analysis of Through Silicon Vias in 3D Packaging

ZHANG Yuanle, GONG Yufan, CHEN Zhaochuan, ZHAO Qi, MENG Xin, LI Qiang, CHEN Xuemei

Journal of Engineering Thermophysics ›› 2024, Vol. 45 ›› Issue (11) : 3508-3516.

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工程热物理学报

Journal of Engineering Thermophysics

PDF(22298 KB)

Journal of Engineering Thermophysics ›› 2024, Vol. 45 ›› Issue (11) : 3508-3516.

Electrical-thermal-structural Coupling Analysis of Through Silicon Vias in 3D Packaging

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