Deformation Characteristics of Compound Droplets in a Microfluidic Chip

Deformation Characteristics of Compound Droplets in a Microfluidic Chip

XUE Yifan, YANG Jiawang, HE Yongqing, YANG Wei, ZHU Hengxuan, DU Hongxian, WANG Jin

Journal of Engineering Thermophysics ›› 2026, Vol. 47 ›› Issue (2) : 561-567.

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工程热物理学报

Journal of Engineering Thermophysics

PDF(15121 KB)

Journal of Engineering Thermophysics ›› 2026, Vol. 47 ›› Issue (2) : 561-567.

Deformation Characteristics of Compound Droplets in a Microfluidic Chip

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2026, 47(2): 561-567

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