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工程热物理学报
Journal of Engineering Thermophysics
Journal of Thermal Science
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Submission
Study on the Performance of a Novel High Temperature Coupled Heat Pump Cycle
SUN Jian, MA Shicai, HUO Cheng, GE Zhihua, YANG Yongping
Journal of Engineering Thermophysics . 2024, (
12
): 3611 -3617 .
