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工程热物理学报

Journal of Engineering Thermophysics
Deformation Characteristics of Compound Droplets in a Microfluidic Chip
XUE Yifan, YANG Jiawang, HE Yongqing, YANG Wei, ZHU Hengxuan, DU Hongxian, WANG Jin
Journal of Engineering Thermophysics . 2026, (2): 561 -567 . 

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